2020-04-29
李小俚教授，中心主任。邮箱：xiaoli@bnu.edu.cn
教育经历
1988.09-1992.07昆明理工大学机械系 学士
1992.09-1994.12昆明理工大学机械系 硕士
1995.03-1998.03哈尔滨工业大学机电工程学院 博士
工作经历
1998.01-1998.04 哈尔滨工业大学机电工程学院助理教授
1998.04-1998.10 香港城市大学制造工程与工程管理系研究助理
1998.11-2000.10 香港城市大学制造工程与工程管理系研究员
2000.11-2002.10 德国Hannover大学IFW 洪堡学者
2002.11-2003.09 香港中文大学计算机辅助工程系博士后研究员
2003.09-2009.06 英国Birmingham大学计算机学院研究员
2002-2010 燕山大学电气工程学院教授
2004-2010 燕山大学控制科学与工程专业博士生导师
2007-2010 燕山大学自动化系主任
2010.12-至今 北京师范大学认知神经国家重点实验室副主任，教授
研究兴趣
主要从事神经信息与工程、科学仪器与医疗器械、自动智能状态监控、微弱信号检测与信号处理等。
科研项目
国家重大科研仪器研制项目：无创高时空分辨的皮层功能网络连接检测装置（61827811），2019-2024，主持；
XXXXXX计划（重点）：基于神经XXXX增强技术（2018110B011），2019-2021，主持；
国家自然科学基金 [国际(地区)合作与交流项目]：孤独症脑认知功能障碍的辅助诊断与调控技术（61761166003），2018-2020，主持；
国家重点研发计划“重大慢性非传染性疾病防控研究”重点专项：儿童脑发育障碍的早期识别和综合干预（子课题：神经心理行为及电生理研究在早期识别中的应用）（2016YFC1306203），2016-2020，子项目主持。
论文代表作
Zhou T, Kang J, Cong F, & Li X (2020) Early Childhood Developmental Functional Connectivity of Autistic Brains with Non-Negative Matrix Factorization. NeuroImage: Clinical :102251.
Zhao J , et al. (2020) Decision-Making Selector (DMS) for Integrating CCA-based Methods to Improve Performance of SSVEP-Based BCIs. IEEE T Neur Sys Reh :1-1.
Wang X, Yan J, Wang Z, Li X, & Yuan Y (2020) Neuromodulation Effects of Ultrasound Stimulation Under Different Parameters on Mouse Motor Cortex. IEEE T Bio-Med Eng 67(1):291-297.
Liang Z , et al. (2020) Information Integration and Mesoscopic Cortical Connectivity during Propofol Anesthesia. Anesthesiology 132(3):504-524.
Li WG, Duan Y, Yan JQ, Gao H, & Li X (2020) Association between Loss of Sleep-specific Waves and Age, Sleep Efficiency, Body Mass Index, and Apnea-Hypopnea Index in Human N3 Sleep. Aging And Disease 11(1):73-81.
Yuan Y, Wang Z, Wang X, Yan J, Liu M, & Li X (2019) Low-intensity pulsed ultrasound stimulation induces coupling between ripple neural activity and hemodynamics in the mouse visual cortex. Cerebral Cortex 29(7):3220-3223.
Chen D, Hu Y, Wang L, Zomaya A Y, & Li X (2016) H-PARAFAC: Hierarchical parallel factor analysis of multidimensional big data. IEEE Transactions on Parallel and Distributed Systems 28(4):1091-1104.
Chen D, Li X, Wang L, Khan S U, Wang J, Zeng ., & Cai C (2014) Fast and scalable multi-way analysis of massive neural data. IEEE Transactions on Computers 64(3):707-719.
Wang J, Wei Y, Wen J, & Li X (2015) Skin burn after single session of transcranial direct current stimulation (tDCS). Brain stimulation 8(1):165.
Wang J, Gao D, Li ., Desroches A S, Liu L, & Li X (2014) Theta–gamma coupling reflects the interaction of bottom-up and top-down processes in speech perception in children. NeuroImage 102:637-645.
Li Z, Ouyang G, Yao L, & Li X (2014) Estimating the correlation between bursty spike trains and local field potentials. Neural networks 57:63-72.
Chen J, Chen D, Li X, & Zhang K (2013) Towards improving social communication skills with multimodal sensory information. IEEE Transactions on Industrial Informatics 10(1): 323-330.
Zhang X, Hu S, Chen D, & Li X (2011) Fast covariance matching with fuzzy genetic algorithm. IEEE Transactions on Industrial Informatics 8(1): 148-157.
Li X, Bowers C P, & Schnier T (2009) Classification of energy consumption in buildings with outlier detection. IEEE Transactions on Industrial Electronics 57(11): 3639-3644.
Li X, & Ouyang G (2010) Estimating coupling direction between neuronal populations with permutation conditional mutual information. NeuroImage 52(2): 497-507.
Li X, Ouyang G., Usami A, Ikegaya Y, & Sik A (2010) Scale-free topology of the CA3 hippocampal network: a novel method to analyze functional neuronal assemblies. Biophysical journal 98(9):1733-1741.
Li X, Li D, Voss L J, & Sleigh J W (2009) The comodulation measure of neuronal oscillations with general harmonic wavelet bicoherence and application to sleep analysis. NeuroImage 48(3): 501-514.
Li X, Tso S K, Guan X P, & Huang Q (2006) Improving automatic detection of defects in castings by applying wavelet technique. IEEE Transactions on Industrial Electronics 53(6): 1927-1934.
Li X, & Yao X (2005) Multi-scale statistical process monitoring in machining. IEEE Transactions on Industrial Electronics 52(3): 924-927.
